| CVE |
Vendors |
Products |
Updated |
CVSS v3.1 |
| Information disclosure in IOE Firmware while handling WMI command. |
| Memory corruption when the payload received from firmware is not as per the expected protocol size. |
| Memory corruption when BTFM client sends new messages over Slimbus to ADSP. |
| Memory corruption in HLOS while invoking IOCTL calls from user-space. |
| Transient DOS in Bluetooth Host while rfc slot allocation. |
| Memory corruption in Audio while processing RT proxy port register driver. |
| Memory corruption when the IOCTL call is interrupted by a signal. |
| Memory corruption while operating the mailbox in Automotive. |
| Memory corruption in BT controller while parsing debug commands with specific sub-opcodes at HCI interface level. |
| Transient DOS while parsing MBSSID during new IE generation in beacon/probe frame when IE length check is either missing or improper. |
| Memory corruption in DSP Service during a remote call from HLOS to DSP. |
| Transient DOS while processing 11AZ RTT management action frame received through OTA. |
| Memory corruption in Core when updating rollback version for TA and OTA feature is enabled. |
| Cryptographic issue in Automotive while unwrapping the key secs2d and verifying with RPMB data. |
| Memory corruption in TZ Secure OS while requesting a memory allocation from TA region. |
| Memory corruption in HLOS while running playready use-case. |
| Possible use after free when process shell memory is freed using IOCTL call and process initialization is in progress in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking |
| Memory corruption due to use after free issue in kernel while processing ION handles in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables |
| Memory corruption in Audio during playback with speaker protection. |
| Information disclosure due to buffer over read in kernel in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Mobile |