| CVE |
Vendors |
Products |
Updated |
CVSS v3.1 |
| Memory corruption while processing finish_sign command to pass a rsp buffer. |
| Memory corruption while processing pin reply in Bluetooth, when pin code received from APP layer is greater than expected size. |
| Memory Corruption in Data Modem while making a MO call or MT VOLTE call. |
| Transient DOS in Bluetooth Host while rfc slot allocation. |
| Transient DOS while parsing probe response and assoc response frame. |
| Memory corruption while processing concurrent IOCTL calls. |
| Memory corruption in Audio while calling START command on host voice PCM multiple times for the same RX or TX tap points. |
| Information disclosure while parsing the BSS parameter change count or MLD capabilities fields of the ML IE. |
| Memory corruption when HLOS allocates the response payload buffer to copy the data received from ADSP in response to AVCS_LOAD_MODULE command. |
| Memory corruption in video while parsing invalid mp2 clip. |
| Memory corruption while processing Listen Sound Model client payload buffer when there is a request for Listen Sound session get parameter from ST HAL. |
| Memory corruption in MPP performance while accessing DSM watermark using external memory address. |
| Memory corruption in SPS Application while requesting for public key in sorter TA. |
| Memory corruption in Audio when memory map command is executed consecutively in ADSP. |
| Transient DOS in WLAN Firmware while parsing rsn ies. |
| Transient DOS while parsing MBSSID during new IE generation in beacon/probe frame when IE length check is either missing or improper. |
| Memory corruption when Alternative Frequency offset value is set to 255. |
| Memory corruption in HLOS while running playready use-case. |
| Possible use after free when process shell memory is freed using IOCTL call and process initialization is in progress in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking |
| Memory corruption due to use after free issue in kernel while processing ION handles in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables |
